Apparatus for mounting processors for cluster computing

ABSTRACT

A bracket for mounting a processor and a support structure for receiving bracket-supported processors for cluster computing are provided. In some embodiments, a bracket may be configured to receive a processor and fasten the processor to the bracket. The bracket may be configured to mount the processor to a support structure. The support structure may be configured to receive an array of brackets. The support structure may be configured to be stacked in combination with additional support structures.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.15/849,846, filed Dec. 21, 2017 (now allowed), which is a continuationof U.S. patent application Ser. No. 15/848,369, filed Dec. 20, 2017, thecontents of both of which are expressly incorporated herein by referencein their entireties.

TECHNICAL FIELD

The present disclosure generally relates to an apparatus for mountingmultiple processors for cluster computing.

BACKGROUND

As technology has developed, the need for processing power has alsoincreased. Cluster computing is a technique often employed to addressthis demand for increased processing power. In a computer cluster,multiple processors may be connected to each other to operate inparallel to perform coordinated operations. The connections may be madethrough hardware, networks, and/or software to cause the multipleprocessors in the cluster to function as a single system, workingtogether to accomplish a programmed task. The multiple processors may belocated in physical proximity to each other for ease of execution.

In a cluster application, each computing unit is referred to as a“node.” A node may be formed of a single processor or a processor set,to perform a particular task designated by a server. Cluster computinginvolves multiple servers coordinating tasks across multiple nodes. Indoing so, cluster applications offer increased performance over the useof a single processor and are often employed in supercomputers for awide range of computationally intensive tasks in the field ofcomputational science.

Types of computer cluster models include load-balancing clusters,high-availability clusters, and high-performance clusters. Aload-balancing cluster model allocates the number of users ortransactions of a particular system across a plurality of nodes. Thisincreases the efficiency and processing time of a server. In ahigh-availability cluster model, multiple servers interact with aplurality of nodes such that certain servers replicate the operations ofother servers to allow continued processing in the event of failure of asingle node in the computer cluster. A high-performance cluster modelprovides parallel data processing for data-intensive computing. In allcluster computer models, advantages may include increased costefficiency achieved from reduced power consumption and speed compared touse of mainframe computers, increased processing speed, improved networkinfrastructure, and flexibility for upgrades and adding additionalcomponents to the system.

One of the obstacles associated with cluster applications is the limitedavailability of devices for mounting processors employed in clustercomputing without impeding the above-mentioned advantages. Brackets areoften used for mounting processors. However, difficulties are oftenencountered when using brackets for mounting processors for clusterapplications, including excessive heat generation and limited access tointerfaces on the processor.

A large number of component failures in clusters are heat-related. Thus,there is a demand for a bracket and cluster mount configuration thatreduces heat-related failures in order to increase the overallreliability of the cluster.

Brackets currently available support individual processors horizontally.In such an arrangement, the major surface of the processor is generallyparallel to a mounting surface, and in cluster configurations eachprocessor is generally stacked on top of one another with limited spacebetween each processor.

This arrangement exacerbates the problem of overheating and minimizesthe ability to effectively cool the processors without complex coolingarrangements (e.g., using high air-flow fans, heat sinks, and evenliquid-cooling). One challenge associated with cooling through the useof a fan is that the nearby space to which the hot air is forced may beoccupied by other processors or even other clusters of processors.Conversely, a cluster may receive hot air discharged by the cooling fanof a nearby cluster. This reduces the overall effectiveness of thecooling system which often does not realize a net reduction of heatsurrounding the cluster. Therefore a need exists for curingoverheating-induced failures.

While brackets exist for supporting processors, such brackets mayexhibit difficulty in supporting processors having a plurality of portsfor interfacing with related devices. For example, Raspberry Pi is alow-cost, widely-used, single-board computer configured to accept aplurality of inputs including USB, MicroSD cards, Display SerialInterface, micro USB Power input, HDMI, Camera Serial Interface port,composite video and audio output jack, LAN port, GPIOs pins, etc.Existing brackets mount processors in pairs to a single bracket, oftenshielding an edge of the processor, which makes it difficult to accessports located on the processor and interface other hardware with theprocessor.

Existing brackets combined with the stacked cluster configurationdescribed above limit user accessibility to an individual processor andalso exacerbate the issue of the heat-induced failures. For example, auser may need to troubleshoot or replace a failed individual processorwithin the cluster. However, this may be difficult or impossible to dowithout disrupting the whole cluster, because the target processor maybe supported in a dense field of other processors or may be secured to abracket that is securing another processor. If the failed processor isnot replaced, other processors in the cluster may experience a greaterload and may generate more heat, leading to more system failures.

Therefore, a need exists for a bracket capable of reducing the number ofheat-induced failures within a cluster, while facilitating clusterconfigurations in which the arrangement of individual processors doesnot impede a user's ability to easily access a targeted processor. Thepresent disclosure is directed to addressing these and other challenges.

SUMMARY

In the following description, certain aspects and embodiments of thepresent disclosure will become evident. It should be understood that thedisclosure, in its broadest sense, could be practiced without having oneor more features of these aspects and embodiments. Specifically, itshould also be understood that these aspects and embodiments are merelyexemplary. Moreover, although disclosed embodiments are discussed in thecontext of a processor bracket and, it is to be understood that thedisclosed embodiments are not limited to any particular industry.

Disclosed embodiments include a bracket for supporting a processorcomprising a base portion configured to receive a first edge of theprocessor. The bracket may also include an upright portion comprising afirst arm and a second arm, the first arm being substantially parallelto the second arm. The bracket may still further comprise a locating pinextending from the base portion in a direction distal to the first armand second arm.

Consistent with another disclosed embodiment, a bracket for supporting aprocessor comprises a base portion configured to receive a first edge ofthe processor. The base portion may comprise a first aperture configuredto receive a fastener to mount the base portion to a surface. Thebracket may also comprise an upright portion configured to support amajor surface of the processor. The upright portion may comprise a firstarm and a second arm. The first arm may be substantially parallel to thesecond arm and extend substantially perpendicular from the base portion.The bracket may still further comprise a first gusset configured tosupport the first arm at an angle relative to the base portion and asecond gusset configured to support the second arm at an angle relativeto the base portion.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory only,and are not restrictive of the disclosed embodiments, as claimed.

BRIEF DESCRIPTION OF DRAWINGS

The accompanying drawings, which are incorporated in and constitute apart of this specification, illustrate several embodiments and, togetherwith the description, serve to explain the disclosed principles. In thedrawings:

FIG. 1 is an isometric view of an exemplary processor bracket, showing anon-mounting side of the bracket, consistent with disclosed embodiments.

FIG. 2 is an isometric view of an exemplary bracket, showing a topsurface of the bracket, consistent with disclosed embodiments.

FIG. 3 is an isometric view of an exemplary bracket, showing a bottomsurface of the bracket, consistent with disclosed embodiments.

FIG. 4 is an isometric view of an exemplary bracket, showing a processormounted to the bracket.

FIG. 5 is a right side view of an exemplary bracket with a processormounted to the bracket.

FIG. 6 is an exploded view of an apparatus for supporting a cluster ofprocessor-bracket assemblies aligned for mounting to an exemplarymounting surface, consistent with disclosed embodiments.

FIG. 7 is an assembled view of the apparatus of FIG. 6.

FIG. 8 is an illustration of a stacked apparatus for supporting acluster of brackets, consistent with disclosed embodiments.

DETAILED DESCRIPTION

Reference will now be made in detail to exemplary embodiments, examplesof which are illustrated in the accompanying drawings and disclosedherein. Wherever convenient, the same reference numbers will be usedthroughout the drawings to refer to the same or like parts.

The disclosed embodiments are directed to a bracket and to a stackedstructure for supporting brackets in cluster applications.

In a cluster, multiple processors operate in parallel to achieveincreased processing power. A mounting system must be employed such thatprocessors in the cluster are physically secured to ensure mechanicalstability of a system but in such a way to allow access to theprocessors and their interfaces to facilitate maintenance of the system.Moreover, the mounting system must dissipate heat that is generated fromthe processors during their operation thereof while providing minimalinterference to the system as a whole.

The following description provides examples of systems for securing aprocessor to a bracket and an apparatus for mounting a processor forcluster computing. The arrangement of components shown in the Figures isnot intended to limit the disclosed embodiments, as the components usedin the disclosed bracket may vary.

FIG. 1 shows a bracket 100. Bracket 100 may be formed of a layeredacrylic material, for example, by a rapid prototyping process. The rapidprototyping method of manufacturing may include one or more of additivemanufacturing processes, solid freeform fabrication processes, andcomputer numerically controlled (CNC) processes. A number of differentadditive manufacturing processes have been developed that can be used inaccordance with various implementations of this disclosure to rapidlyproduce a prototype or model of the desired bracket from athree-dimensional (3D) data file defining the structure of the bracket.

In accordance with the disclosed embodiment, bracket 100 may include abase portion 105 and an upright portion 110. Upright portion 110 mayextend perpendicularly from base portion 105 and may include a first arm120 and a second arm 130. Upright portion 110 may be supported relativeto the base portion 105, in part by a first gusset member 122 and asecond gusset member 132. First and second gusset members 122 and 133may be substantially triangular in shape and may provide reinforcedsupport at the section of bracket 100 where upright portion 110intersects base portion 105. In particular, first and second gussetmembers 122 and 132 may extend substantially perpendicularly to theupright portion 110, and may extend along a portion of the length ofupright portion 110. First and second gusset members 122 and 132 areconfigured to improve the stiffness and load-bearing strength of bracket100 by reinforcing the intersection of upright portion 110 and baseportion 105, preventing high stress concentrations caused by bendingmoments that would otherwise develop at the intersection.

Bracket 100 may also include a rib 160 where upright portion 110intersects base portion 105. Rib 160 may extend along the length of baseportion 105 of bracket 100 and may be configured to extend substantiallyperpendicularly to upright portion 110. Rib 160 may add strength andstability to minimize deflection of bracket 100. Increasing strength andstability of bracket 100 may further improve the mechanical reliabilityof a processor mounted to bracket 100.

FIG. 2 shows upright portion 110 and base portion 105 of bracket 100.First and second arms 120 and 130 of upright portion 110 may beconfigured to extend substantially perpendicularly from the base portion105, may be substantially parallel to each other and may respectivelyinclude first and second fastener apertures 125 and 135. Apertures 125and 135 may be configured to receive any suitable type of fastener, suchas a bolt or screw, to create a non-permanent joint.

Upright portion 110 may include one or more offset members, such as afirst offset member 128 which extends substantially perpendicularly fromfirst arm 128 and a second offset member 138 which extends substantiallyperpendicularly from second arm 138. First and second offset members 128and 138 may be configured as spacers to surround the first and secondreceiving apertures 125 and 135, respectively. First and offset members128 and 138 may be of substantially the same height and may have flatsurfaces for mating with a major surface of a processor, to be describedbelow.

Base portion 105 may include a ledge 140 for receiving a first edge of aprocessor. Ledge 140 may be configured to extend substantiallyperpendicularly to upright portion 110 and may extend along a partiallength of base portion 105. Ledge 140 may have various edgeconfigurations, such as, for example, a tapered edge, square edge, oraround edge, and may be centered along the length of base portion 105.In another embodiment, ledge 140 may comprise more than one ledgeportion, with multiple ledge portions being positioned symmetricallyabout the center of bracket 100.

Base portion 105 may include a base offset member 148 which may extendsubstantially perpendicularly to upright portion 110. Base offset member148 may be formed of a singular extension along the length of thebracket 100. In another embodiment, base offset member 148 may bedivided into portions positioned symmetrically about the center ofbracket 100. Base offset member 148 may also be configured to extendadjacent to ledge portion 140. Base offset member 148 may be of asubstantially equivalent height as first offset member 128 and secondoffset member 138. In another embodiment, each of first offset member128, second offset member 138 and base offset member 148 may be angledat an equivalent degree as each other offset member.

Referring now to FIG. 3, there is shown a securement tab 150. Securementtab 150 may define a securement aperture 155 for securing a cable to thebracket. Securement tab 150 may extend from a peripheral surface offirst arm 120. Securement tab 150 may assist with cable management bysecuring the cable to the securement tab 150. Cables may extend from oneor more interface ports on a processor. The cable may be secured using acable tie or electrical tape. Cable management may prevent cablesassociated with bracket 100 from becoming tangled with nearby cables.

Base portion 105 may include a mounting aperture 144. Mounting aperturemay be configured to receive a fastener to mount bracket 100 and receivevarious types of fasteners such as a bolt or screw, to create anon-permanent joint. Mounting aperture 144 may extend through baseportion 105 substantially parallel to a locating pin 115. Locating pin115 may extend from base portion 105, distal to ledge 140. Locating pinmay also include a lead tapered featured to allow for smooth couplingwith a receiving surface.

Referring now to FIG. 4, there is shown a bracket-processor assembly200. A processor 210, in the form of a multi-component circuit board,may be mounted to bracket 100 and secured with a fastener 220. A firstedge 218 of processor 210 may be in direct contact with ledge 140, suchthat ledge 140 may exert a normal force on first edge 218 to supportprocessor 210.

Processor 210 may include one or more known processing devices 240 suchas, for example, microprocessors from the Pentium™ or Xeon™ familymanufactured by Intel™, the Turion™ family manufactured by AMD™, or anyof various processors manufactured by Sun Microsystems. Processingdevices 240 of processor 210 may comprise a single-core or multiple-coreprocessors that execute parallel processes simultaneously. For example,processor 210 may incorporate a single-core processor device configuredwith virtual processing technologies. In certain embodiments, processor210 may use logical processor devices to simultaneously execute andcontrol multiple processes. Processor 210 may implement virtual machinetechnologies, or other known technologies to provide the ability toexecute, control, run, manipulate, store, etc. multiple softwareprocesses, applications, programs, etc. In another embodiment. Processor210 may also include a single-board computer (SBC) comprising amicroprocessor and memory built on a single circuit board. The SBC mayfurther comprise ports for interfacing with various pins and connectionssuch as USB 2.0, power input, SD card, or HDMI. Bracket 100 may beconfigured to secure an SBC including: Raspberry Pi 3, Raspberry PiZero, ODROID-XU4, Udoo x86 Ultra, CHIP, Orange Pi, HummingBoard-Gate.Other embodiments may be configured to receive SBCs manufactured byORDOID, Asus, CanaKit, or Arduino.

Processor 210 may also comprise one or more interface ports 230.Processor 210 may be mounted to bracket 100 such that base portion 105does not inhibit the accessibility of interface ports 230. Interfaceports 230 may be configured to receive any of a variety of inputsincluding: USB, MicroSD cards, DSI, power input, HDMI, CSI, compositevideo and audio output jack, LAN port, or GPIOs pins.

Referring now to FIG. 5, there is shown a side view of bracket processorassembly 200. A major surface 215 of processor 210 may be configured tomate with base offset member 148. Major surface 215 of processor 210 maybear against first offset member 128, second offset member 138, and baseoffset member 148. Fasteners 220 may be configured to be receivedthrough each of first and second fastener apertures 124 and 134. Baseoffset member may be configured to space major surface 215 of theprocessor 210 from bracket 100.

Referring now to FIG. 6, there is shown an exploded perspective view ofa mounting structure 300 for supporting an array of bracket-processorassemblies 200 in a cluster assembly 400. Mounting structure 300 mayinclude a spoke and hub configuration including a plurality of spokes340 extending from a spindle 330 to a peripheral ring 350, thus forminga mounting surface 310 configured to bear against a bottom surface ofbrackets 100. Spindle 330 may extend substantially perpendicularly tomounting surface 310. Each spoke 340 may include mounting surface 310for receiving a bracket-processor assembly 200. Apertures 360 betweenspokes 340 may provide for increased air ventilation and cooling throughnatural convection. Apertures 360 may also allow a user to accessinterfaces 230 that may be located on processor 210.

Mounting structure 300 may include a peripheral ring 350 defining theouter perimeter of the mounting surface 310. Mounting surface 310 mayinclude a plurality of receiving apertures 315 in spokes 340 eachconfigured to comprise a geometric cross-section complementary to thecross-section of locating pins 115 s to engage locating pins 115 ofbrackets 100. Mounting surface 310 may also include a plurality ofmounting apertures 344 configured to align with mounting aperture 144 sof brackets 100 when corresponding locating pins 115 are engaged withcorresponding receiving apertures 315.

Referring now to FIG. 7 there is shown is a perspective view of anassembled mounting structure 300. Mounting surface 310 may be configuredto receive a plurality of bracket-processor assemblies 200 such thatprocessors 210 are mounted perpendicular to mounting surface 310.Bracket-processor assemblies 200 may be fastened to mounting surface 310such that interface ports 230 are positioned over aperture 360.

Referring now to FIG. 8, there is shown a stacked support assembly 500comprising two support structures 300 for supporting a plurality ofprocessors 210. A spindle 330 of a first mounting structure 300 a may beconfigured to mate with a bottom surface of a second mounting structure300 b. In this arrangement, a second circular array of bracket-processorassemblies 200 b is stacked above a first circular array ofbracket-processor assemblies 200 a for a cluster application. Althoughstacked support assembly 500 is shown in FIG. 8 as including only twosupport structures 300 a and 300 b, other embodiments of stacked supportassembly 500 may include a plurality of support structures 300 a-300 nstacked to accommodate bracket-processor assemblies 200 for largercluster applications.

While illustrative embodiments have been described herein, the scopethereof includes any and all embodiments having equivalent elements,modifications, omissions, combinations (e.g., of aspects across variousembodiments), adaptations and/or alterations as would be appreciated bythose in the art based on the present disclosure. For example, thenumber and orientation of components shown in the exemplary systems maybe modified. Thus, the foregoing description has been presented forpurposes of illustration only. It is not exhaustive and is not limitingto the precise forms or embodiments disclosed. Modifications andadaptations will be apparent to those skilled in the art fromconsideration of the specification and practice of the disclosedembodiments.

The elements in the claims are to be interpreted broadly based on thelanguage employed in the claims and not limited to examples described inthe present specification or during the prosecution of the application,which examples are to be construed as non-exclusive. It is intended,therefore, that the specification and examples be considered asexemplary only, with a true scope and spirit being indicated by thefollowing claims and their full scope of equivalents.

What is claimed is:
 1. A support structure for mounting an array ofbrackets, comprising: a first plate configured to receive an array ofbrackets; a spindle extending substantially perpendicular to the firstplate, wherein the first plate comprises an inner perimeter configuredto engage the spindle and a plurality of radial segments extending fromthe spindle to a peripheral ring of an outer perimeter of the firstplate; a first aperture extending from the spindle to the peripheralring of the outer perimeter, the first aperture separating a first oneof the radial segments and a second one of the radial segments, whereinthe first one of the radial segments is of substantially a same width asa base portion of one bracket; and a second aperture configured toreceive a locating pin of the first bracket of the array of brackets. 2.The support structure of claim 1, wherein the first plate issubstantially similar.
 3. The support structure of claim 1, wherein thefirst one of the radial segments comprises a mounting surface configuredto bear against a bottom surface of the base portion of the one bracket.4. The support structure of claim 3, wherein the mounting surface isconfigured to receive the one bracket such that a processor in the onebracket is substantially perpendicular to the mounting surface.
 5. Thesupport structure of claim 1, further comprising a third apertureconfigured to receive a fastener.
 6. The support structure of claim 5,wherein the second aperture and the third aperture extend substantiallyparallel to the spindle and at least partially through the first one ofthe plurality of radial segments.
 7. The support structure of claim 1,wherein the second aperture comprises a cross section sized to engagethe locating pin.
 8. The support structure of claim 1, furthercomprising a plurality of first apertures separating respective ones ofthe plurality of radial segments.
 9. The support structure of claim 8,wherein the array of brackets comprises eight brackets.
 10. The supportstructure of claim 1, wherein the first plate or the spindle or bothcomprises a layered acrylic material formed from a three-dimensionalprinting process.
 11. The support structure of claim 1, furthercomprising a second plate configured to receive a second array ofbrackets.
 12. The support structure of claim 11, wherein the secondplate comprises an inner perimeter configured to engage the spindle. 13.The support structure of claim 12, wherein the second plate issubstantially parallel to the first plate.
 14. The support structure ofclaim 11, wherein the second array of brackets comprises eight brackets.15. The support structure of claim 11, wherein the spindle comprises aproximal portion configured to engage with the first plate and a distalportion configured to engage with the second plate.
 16. The supportstructure of claim 1, wherein the plurality of radial segments arearranged substantially symmetrically about the first plate.
 17. Thesupport structure of claim 11, wherein the second plate comprises alayered acrylic material formed from a three-dimensional printingprocess.
 18. The support structure of claim 15, wherein the spindlecomprises layered acrylic material formed from a three-dimensionalprinting process.
 19. The support structure of claim 12, wherein thesecond plate comprises a plurality of radial segments extending from thespindle to an outer perimeter of the second plate.